BAD NEUSTADT SITE

We have been manufacturing electronics at our headquarters since the 1960s. Today, we have a state-of-the-art electronics production facility that meets automotive standards. Here we produce electronics according to the built-to-print principle as well as individually developed electronics for completely integrated systems. 

Founded: 1919
Number of employees: 1500
Total area: 60,000 square meters
Production area: 12,000 square meters

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DIPPACH SITE

For many years, millions of car radios and navigation systems were produced here. We currently manufacture electronics for control units, switch modules and instrument clusters in the automotive / commercial vehicle sectors. We also manufacture electronics according to built-to-print as well as for e-mobility high-voltage applications and battery management.

Founded: 1990
Employees: 200
Total area: 45,000 m2
Production area: 4,500 m2

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NINGBO SITE

Our site in Ningbo has a state-of-the-art electronics production facility that meets automotive standards. Here we manufacture electronics according to built-to-print as well as electronics for fully integrated HMI systems and e-mobility components.

Founded: 2010
Employees: 1,150
Total area: 56,000 m2
Production area: 21,000 m2

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In a nutshell: What are electronic manufacturing services?

Electronic manufacturing services (EMS) encompass all services related to the contract manufacturing of electronic assemblies, devices, and systems. 
EMS companies generally see themselves not only as pure manufacturing service providers, but also take on tasks across the entire EMS value chain.

These include:

1. Design and development
The EMS service provider provides support in product development, prototype construction, and the design of circuit diagrams and layouts.

2. Material procurement
He is responsible for purchasing and managing components, takes care of supplier qualification, and also manages the handling of discontinued components.

3. Manufacturing / Production
The focus is on manufacturing. This includes printed circuit board assembly (SMT/THT), the assembly of modules and complete devices, and quality and process control (e.g., AOI, ICT, or functional tests). The service provider carries out further electrical, functional, and optical tests.

4. Logistics and after-sales service
At last, final assembly, packaging, and shipping to the OEM take place. The EMS service provider can offer warehousing and repair services to a certain extent. In addition, complete traceability must be guaranteed.

 

What is the difference between EMS and OEM?

The OEM (Original Equipment Manufacturer) acts as the seller to the end customer. It owns the product and the brand and commissions the EMS service provider to manufacture the products or, as described above, to take over the entire production process without its brand coming to the fore.

What is the difference between EMS and Tier 1?

A Tier 1 supplier is the first in the supply chain hierarchy below the OEM.
Accordingly, the term Tier 1 describes the position in the supply chain (directly to the OEM), whereas EMS describes the type of service (electronics manufacturing services). Not every Tier 1 supplier is an EMS provider, and smaller EMS providers may be Tier 2 or Tier 3 suppliers who in turn supply larger suppliers.

What is SMT/THT?

In SMT (Surface Mount Technology), components are placed directly on the surface of the circuit board and soldered. In THT (Through-Hole Technology), components with connecting wires are inserted through holes in the circuit board and then soldered.
THT components are often used when the components cannot be miniaturized economically due to their electrical properties (current consumption, power, voltage resistance, etc.).

What is AOI?

Automated Optical Inspection (AOI) uses one or more cameras and comprehensive software analyses to enable quality assurance by detecting potential errors at an early stage. These findings are used to optimize manufacturing processes.

What are ICT and flying probe?

In-circuit testing identifies manufacturing defects such as short circuits, broken connections, missing or incorrect components. A product-specific needle adapter is used to make contact with the individual paths. Several thousand test points can be contacted simultaneously on both sides of the assembled electronics. Flying probe tests (FPT), on the other hand, use a few movable test probes and measure path by path in sequence.
The ICT test is more suitable for mass production, while the flying probe test, with its high flexibility, is more suitable for smaller series and especially for prototypes.
The aim of both tests is to check the assembly and electrical properties of the electronics before a functional test is carried out.